Title:
半導体光素子用チップキャリア、光モジュール、及び光送受信器
Document Type and Number:
Japanese Patent JP4393187
Kind Code:
B2
Abstract:
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
Inventors:
Noriko Sasada
Kazuhiko Naoe
Masataka Shirai
Arimoto Hideo
Satoshi Tada
Kazuhiko Naoe
Masataka Shirai
Arimoto Hideo
Satoshi Tada
Application Number:
JP2003432013A
Publication Date:
January 06, 2010
Filing Date:
December 26, 2003
Export Citation:
Assignee:
Japan Opnext Co., Ltd.
International Classes:
H01L23/12; H01S5/022; H01L23/13; H01L27/15; H01S5/02; H01S5/062
Domestic Patent References:
| JP9133900A | ||||
| JP54534U | ||||
| JP2001320065A | ||||
| JP936274A | ||||
| JP2281679A | ||||
| JP4237179A | ||||
| JP9181359A | ||||
| JP2003318450A | ||||
| JP200378197A |
Attorney, Agent or Firm:
Manabu Inoue