Title:
TRANSFER DEVICE OF CHIP COMPONENT
Document Type and Number:
Japanese Patent JP2022026864
Kind Code:
A
Abstract:
To provide a transfer device of a chip component, capable of surely transferring the chip component to a flexible member having an adhesive force.SOLUTION: A transfer device of a chip component, a first stage capable of holding a temporal substrate with the chip component, on which the chip component is arranged and formed on the temporal substrate; a second stage to which a ring-like fixed member is attached to the circumference, and which can hold a flexible member having an adhesive force on a front surface; and a driving mechanism which is provided to at least one of the first and second stages, and relatively moves the first and second stages so that the first stage and the second stage are closed or separated. The second stage provides a convex part provided integrally or separately to the front surface supporting the flexible member, projected from the front surface supporting the flexible member, and contacted to the flexible member.SELECTED DRAWING: Figure 3
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Inventors:
SUGIMOTO NORIYUKI
AWANO TORU
TSURUGA MITSUAKI
AWANO TORU
TSURUGA MITSUAKI
Application Number:
JP2020130527A
Publication Date:
February 10, 2022
Filing Date:
July 31, 2020
Export Citation:
Assignee:
V TECH CO LTD
International Classes:
H01L21/683; H01L33/48
Attorney, Agent or Firm:
Patent business corporation glory patent office