Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CHIP COMPONENT
Document Type and Number:
Japanese Patent JPH06283386
Kind Code:
A
Abstract:

PURPOSE: To suppress crosstalk between adjacent elements by providing a ground conductor and an electrode for taking out the ground conductor adjacent to each passive element.

CONSTITUTION: A square insulation substrate 11 with a plurality of recessed parts is provided at both opposing edges and a plurality of lower layer conductors 12 are provided in the direction of width on the insulation substrate 11 so that both edge parts reach the recessed part. The lower layer conductor 12 is connected to a rear surface electrode 17 via a through hole. Further, an upper layer conductor 14 is formed on a thick-film dielectric 13 formed on the lower layer conductor 12. Then, a ground conductor 18 is formed similarly as the lower layer conductor 12 and then an electrode 19 for taking out ground conductor for grounding the ground conductor 18 is provided, thus reducing the crosstalk between adjacent passive elements.


Inventors:
SOBANE MINORU
IZEKI TAKESHI
HOSHITOKU SEIJI
IKEDA TAKASHI
NISHIDA KOJI
Application Number:
JP6959393A
Publication Date:
October 07, 1994
Filing Date:
March 29, 1993
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01G2/00; H01G4/35; H01G4/40; H05K1/02; (IPC1-7): H01G4/40; H01G4/42
Attorney, Agent or Firm:
Akira Kobiji (2 outside)