CHIP ELECTRONIC COMPONENT AND ITS MANUFACTURE

Title:

CHIP ELECTRONIC COMPONENT AND ITS MANUFACTURE

Document Type and Number:

Japanese Patent JP3515329

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a chip electronic component, in which a mechanical shocks due to the injection pressure of a molten resin for outer-shell formation can be relaxed, without spoiling the operating property and to provide its manufacturing method.
SOLUTION: In a manufacturing meted for a chip electronic component, an outer shell 9 which is made of a resin is formed by an injection molding operation with respect to an electronic-component element 4. In the manufacturing method, a resin body which is composed of a thermosetting resins is arranged on the opposite face to a gate 101 of a molding mold 100 out of the surface of the electronic-component element 4, the resin body is then heated so as to be melted and hardened, a shock-absorbing body 51 is formed on the opposite face, and the outer shell 9 is formed by the injection molding operation with respect to the electronic-component element 4 and the shock-absorbing body 51.

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Inventors:

Kamikawa, Hidenori
Kishimoto, Yasuhiro

Application Number:

JP16378597A

Publication Date:

April 05, 2004

Filing Date:

June 20, 1997

Export Citation:

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Assignee:

SANYO ELECTRIC CO LTD
SANYO DENSHI BUHIN KK

International Classes:

H01G9/012; H01G9/04; H01G9/08; H01G13/00; (IPC1-7): H01G9/08; H01G9/012; H01G13/00

Attorney, Agent or Firm:

丸山敏之（外１名）

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