Chip electronic parts and a manufacturing method for the same

Title:

Chip electronic parts and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP6104863

Kind Code:

B2

Inventors:

Park Moon Seo
Kim Tae Yeon
Lee Dong Huang

Application Number:

JP2014177796A

Publication Date:

March 29, 2017

Filing Date:

September 02, 2014

Export Citation:

Assignee:

Samsung Electro-Mechanics Co., Ltd.

International Classes:

H01F17/04; H01F17/00; H01F27/24; H01F27/255; H01F37/00; H01F41/04

Domestic Patent References:

JP2013110171A
JP200949335A

Attorney, Agent or Firm:

Konobu Kato

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