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Title:
CHIP ELEMENT WITH SENSOR
Document Type and Number:
Japanese Patent JP2000258377
Kind Code:
A
Abstract:

To provide a chip element with sensor that has various kinds of sensors, is in a simple configuration and can reduce volume, and can be surface- mounted to a circuit substrate.

A chip element with sensor is provided with a chip base 12 made of such insulation material as ceramics, a conductor pattern 18 on its outer surface, and a plurality of sensors 22 connected to the conductor pattern 18 on the surface of the base 12. The sensor 22 is a moisture sensor where a hygroscopic material 20 such as a hygroscopic polymer is provided at end parts that oppose each other while being separated slightly each other at the surface center part of the base 12 in the conductor pattern 18.


Inventors:
OBARA YOZO
Application Number:
JP2000000606A
Publication Date:
September 22, 2000
Filing Date:
January 06, 2000
Export Citation:
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Assignee:
HOKURIKU ELECT IND
International Classes:
G01N27/12; (IPC1-7): G01N27/12
Attorney, Agent or Firm:
Hirosawa Isao