Title:
CHIP FUSE
Document Type and Number:
Japanese Patent JP2011082064
Kind Code:
A
Abstract:
To provide a chip fuse capable of surely melting a fuse element made from a metal resinate when excessive current flows.
In the chip fuse, a surface electrode 3 and an undercoat 13 are formed on the surface of an insulating board 1, and a thick-film fuse element 17 made from the metal resinate is formed on the surface electrode 3 and the undercoat 13. Then, the thick-film fuse element 17 is covered with an overcoat made from an insulating resin material with burning temperature lower than the burning temperature of the metal resinate.
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Inventors:
Takeuchi, Katsumi
Kurokawa, Hiroyuki
Kurokawa, Hiroyuki
Application Number:
JP2009000234421
Publication Date:
April 21, 2011
Filing Date:
October 08, 2009
Export Citation:
Assignee:
HOKURIKU ELECTRIC IND CO LTD
International Classes:
H01H85/17; H01H37/76; H01H85/044; H01H85/05