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Patent Searching and Data


Title:
CHIP-LIKE HOT-MELT ADHESIVE MATERIAL, ITS PREPARATION, AND USE
Document Type and Number:
Japanese Patent JPS5582176
Kind Code:
A
Abstract:

PURPOSE: The title adhesive material capable of joining parts firmly with certainty, improving the productivity, and automating the joining operation of various parts, prepared by molding a hot-melt resin into the chips corresponding to the joint surface.

CONSTITUTION: The hot-melt adhesive materials a and b molded into the shape corresponding to the joint surface are inserted into a given position of the plastic base 8 and case 10 before the assembling of the condenser 9 and the ferrite disk 11. The parts 9 and 11 are then assembled to insert the materials, which are heat- treated and molten to adhere to the joint surface. The hardened resin provides the firm joining without staining the surroundings.


Inventors:
ISHIKAWA MICHIO
Application Number:
JP15657978A
Publication Date:
June 20, 1980
Filing Date:
December 16, 1978
Export Citation:
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Assignee:
TDK ELECTRONICS CO LTD
International Classes:
B29C41/00; B29B7/00; B29C31/00; B29C39/00; B29C39/06; B29C39/24; B29C39/26; C09J5/00; C09J5/10; C09J11/00; H05K3/34; H05K3/30; (IPC1-7): B29C5/10; C09J3/00; C09J5/10; H05K3/30