To obtain a chip, a manufacturing method for the chip and a chip storing module storing the chip by which a higher yield is obtained from one wafer with respect to a grating in which a shape occupied by the whole element on the wafer like an array waveguide grating is formed into a shape other than a rectangle.

Patterns 102 of the array waveguide grating are respectively formed in arcuate regions where two curved parts formed into a projected type in the same direction are arranged at a prescribed interval and respective end parts are combined by two mutually parallel straight lines on the wafer 101. More chips are manufactured compared with a case when the patterns 102 of the array waveguide grating are cut out in the rectangular shape by cutting out these with linear cutting passes 103A and curved cutting passes 103B in which two arcuations having the same shape end other are continued in the lateral direction. A ultrasonic working technique and a sand blast working technique or the like are used for the cutting out.