Title:
CHIP MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021180203
Kind Code:
A
Abstract:
To provide a chip manufacturing method capable of suppressing occurrence of a processing defect.SOLUTION: A chip manufacturing method for manufacturing a plurality of chips by dividing a workpiece divided into a plurality of regions by predetermined dividing lines includes the steps of: cutting the workpiece with an annular cutting blade being vibrated in a radial direction of the cutting blade in a frequency belonging to an ultrasonic band, thereby forming cut grooves of a depth less than a thickness of the workpiece along the predetermined cutting lines in the workpiece; and applying an external force to the workpiece, thereby dividing the workpiece into the plurality of chips along the predetermined dividing lines with the cut groove defined as origins.SELECTED DRAWING: Figure 7
Inventors:
HIRAIWA TAKU
Application Number:
JP2020082986A
Publication Date:
November 18, 2021
Filing Date:
May 11, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B1/04; B24B27/06
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano
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