Title:
チップの製造方法
Document Type and Number:
Japanese Patent JP7442927
Kind Code:
B2
Abstract:
To provide a new manufacturing method of a chip, capable of manufacturing a plurality of chips by appropriately dividing a plate-like processed material in which a film containing a metal is provided on a back surface side.SOLUTION: A manufacturing method of a chip, used for manufacturing a plurality of chips by dividing a plate-like processed material in which a film containing a metal is provided on a back surface side, includes: a film segmentation step of segmenting a film with a division scheduled line by forming a groove overlapped with the division scheduled line provided to the processed material on the back surface side of the processed material; a blur removing step of removing blur generated in the groove in the film segmentation step by injecting water toward the back surface side of the processed material after the film segmentation step; and a division step of dividing the processed material with the division schedule line through plasma etching and forming the plurality of chips after the blur removing step.SELECTED DRAWING: Figure 1
Inventors:
Park Mitama
Application Number:
JP2019144196A
Publication Date:
March 05, 2024
Filing Date:
August 06, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B27/06; H01L21/3065
Domestic Patent References:
| JP2018186133A | ||||
| JP2018181903A | ||||
| JP2017168508A | ||||
| JP2005279894A | ||||
| JP2007125667A | ||||
| JP2019096759A | ||||
| JP2019102514A | ||||
| JP2018181904A | ||||
| JP2016160577A | ||||
| JP2016134433A |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
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