To enable reduction in the possibility that a micro crack is generated at a portion where a plane part and a bottom part cross each other, causing a crack in a protruding portion and isolating a chip network electronic component from an electrode.

This competent has a plurality of element, such as, resistors or capacitors, on the surface of a base, and a plurality of recessed parts one the outer periphery thereof, each of which includes a pair of plane parts 8A and a bottom part 8B continued to both plane parts 8A. Protruding parts between the recessed parts are formed as electrodes. In this case, by chamfering a part where the plane part 8A and the bottom part 8B of the recessed part cross each other, so as to have a radius greater than 0.1mm, generation of a crack in the protruding part is prevented to reduce the possibility of a defective product.