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Title:
CHIP PART CONVEYING DEVICE
Document Type and Number:
Japanese Patent JP2010275097
Kind Code:
A
Abstract:

To provide a chip part conveying device capable of conveying a chip part and certainly taking out it in a storage box without generating crack and chip.

The chip part conveying device includes a conveying means for conveying the chip part 10 to a part taking out part; an urging means for giving propulsion force required for taking out the chip part by spraying a gas to the chip part and conveying it to a predetermined position; and a conveying hose 9 for receiving the discharged chip part and passing it through the inside; and the storage box 30 for receiving the chip part conveyed through the conveying hose and storing it. On a connection part of the conveying hose 9 and the storage box 30, a shock absorbing member 31 comprising an elastic material (rubber) including a through-hole 31a passed with the chip part is arranged, and impact applied to the chip part is reduced at a conveying process by absorbing motion energy of the chip part passing through the through-hole 31a.


Inventors:
TANAKA KAIICHI
KANAYA MITSUHIRO
Application Number:
JP2009132038A
Publication Date:
December 09, 2010
Filing Date:
June 01, 2009
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
B65G47/84
Domestic Patent References:
JPH072326A1995-01-06
JP2007246214A2007-09-27
JP2007186311A2007-07-26
JP2007186310A2007-07-26
Attorney, Agent or Firm:
Hitoshi Nishizawa