PURPOSE: To efficiently make a small-sized and thinned chip parts of electrically large capacitance, and also to make a small-sized and thinned machine by a method wherein the protruding part of a protruding type chip part is inserted into the aperture part provided on a printed substrate, and a soldering work is conducted thereon.
CONSTITUTION: A stepped part is provided on both ends of a chip part 1 and it is protrudingly formed. A chip part 1 is inserted into the aperture part 5 of a printed substrate 3, and the electrodes on both sides of the aperture part 5 and the electrodes on both ends of the chip part 1 are soldered using a dip soldering method, a reflow soldering method and the like. The part such as IC 2 and the like is mounted on the upper part of the chip part 1 simultaneously with the chip part 1 or later by a soldering method. As a result, the mounting area of the part can be made small, and the miniaturization or the high density mounting of the part can be made possible.
SAKAGAMI MASAKAZU
TOI YASUO
