Title:
チップ部品回収装置およびチップ部品の回収方法
Document Type and Number:
Japanese Patent JP7439379
Kind Code:
B2
Abstract:
To provide a device for recovering chip components capable of uniformly reducing an impact applied to the chip components.SOLUTION: A device for recovering chip components includes: a recovering part having an upward opening through which the chip components can pass and a bottom plate for supporting chip integrated bodies formed by stacking the plurality of chip components from below to move them in a vertical direction; a sensor disposed in the vicinity of the opening to detect an upper end of the chip integrated body; and a control part for moving the bottom plate according to the detection results of the sensor.SELECTED DRAWING: Figure 2
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Inventors:
Hitoshi Watanabe
Hidekatsu Sato
Masayoshi Kobayashi
Takeshi Kagaya
Hidekatsu Sato
Masayoshi Kobayashi
Takeshi Kagaya
Application Number:
JP2018208924A
Publication Date:
February 28, 2024
Filing Date:
November 06, 2018
Export Citation:
Assignee:
SAE Magnetics(H.K.)Ltd.
International Classes:
B65G57/11; B65G57/03; H01G13/00
Domestic Patent References:
| JP2002280275A | ||||
| JP2002210416A | ||||
| JP62026330U | ||||
| JP2010162662A |
Attorney, Agent or Firm:
Maeda Suzuki International Patent Attorneys Corporation