Title:
チップ部品およびその製造方法
Document Type and Number:
Japanese Patent JP6674677
Kind Code:
B2
Abstract:
A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.
Inventors:
Hiroshi Tamagawa
Yasuhiro Kondo
Yasuhiro Kondo
Application Number:
JP2016028289A
Publication Date:
April 01, 2020
Filing Date:
February 17, 2016
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01C1/034; H01C13/00; H01C17/00; H01C17/02; H01F17/00; H01F27/02; H01G2/10; H01G4/30; H01G4/32; H01L21/822; H01L27/04
Domestic Patent References:
| JP2013232620A | ||||
| JP2015153874A | ||||
| JP2070402U | ||||
| JP2014072242A | ||||
| JP2010199171A |
Foreign References:
| WO2014069363A1 |
Attorney, Agent or Firm:
Inaoka cultivation
Mio Kawasaki
Kyoumura Junji
Mio Kawasaki
Kyoumura Junji