Title:
CHIP PARTS
Document Type and Number:
Japanese Patent JP2023049959
Kind Code:
A
Abstract:
To provide a chip part capable of improving mechanical strength and insulation, miniaturizing and increasing capacity, and adding an ESD protection function.SOLUTION: A chip part (1) includes: a substrate (2); a capacitor portion (32) including a plurality of wall portions (85) having a lengthwise direction and separated from each other by a trench (107) formed on a first main surface (5); and a substrate body portion (54) formed around the capacitor portion (32) using a portion of the substrates (2). The wall portions (85) are formed of a plurality of pillar units. The capacitor portion (32), in plan view, includes a first capacitor portion (321) including wall portions (85) having the lengthwise direction as first lengthwise direction (D1), and a second capacitor portion (322) including the wall portions (85) having the lengthwise direction as a second lengthwise direction (D2) intersecting with the first lengthwise direction (D1).SELECTED DRAWING: Figure 7
More Like This:
Inventors:
FUKAE KEISUKE
Application Number:
JP2021160038A
Publication Date:
April 10, 2023
Filing Date:
September 29, 2021
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01G4/30; H01G4/33; H01L21/329; H01L21/822; H01L29/06
Attorney, Agent or Firm:
Patent Attorney Corporation Ai Patent Office