PURPOSE: To prevent a chip on a stage from being out of position during bonding.
CONSTITUTION: The following are provided: a stage 11 to mount a chip 1; XY tables 13,14 to move this stage 11 in the XY directions; a regulation means of position of the chip larranged on this stage 11; and a vacuum chuck means 18 to vacuum chuck this position regulation means 17 so as to slide on this stage 11. Further, a chip positioner is constituted of press contactors 33,34 that are located by the side of this stage 11 and are pressed on the position regulation means 17 by XY movement of this stage 11 to press this means 17 on the chip 1 and an initialization means 36 that is pressed on this position regulation means 17 to reset this position regulation means 17 to a home position.
JPH05275488 | FACE DOWN MOUNTING METHOD OF CHIP |
WO/2019/062238 | WAFER LEVEL SYSTEM PACKAGING METHOD AND PACKAGE STRUCTURE |
JPS58219742 | SEMICONDUCTOR DEVICE |