Title:
基板内層用チップ抵抗器
Document Type and Number:
Japanese Patent JP6715024
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a component built-in circuit board capable of reducing surface temperature rise incident to heat generation, while reducing resistance value change caused by flexure stress, and to provide a chip resistor for board inner layer that is built in such a circuit board.SOLUTION: In a component built-in circuit board, a chip resistor 3 is embedded in the resin layer 2 of a base substrate, and a connection via 5 formed in this resin layer 2 is connected with the external electrode of the chip resistor 3. The chip resistor 3 is built in the resin layer 2 while directing the first surface of an insulating substrate, on which a pair of internal electrode and a resistor and a protection film are formed, laterally, and the connection via 5 is connected with the external electrode formed on the second surface adjacent to the first surface and directing upward.SELECTED DRAWING: Figure 1
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Inventors:
Kentaro Matsumoto
Application Number:
JP2016032409A
Publication Date:
July 01, 2020
Filing Date:
February 23, 2016
Export Citation:
Assignee:
koa corporation
International Classes:
H05K3/46; H01C1/142; H01C7/00
Domestic Patent References:
| JP2013153137A | ||||
| JP2013051441A | ||||
| JP11162706A | ||||
| JP2011199188A | ||||
| JP2012079994A | ||||
| JP2007235110A | ||||
| JP9330802A |
Foreign References:
| WO2012133313A1 |
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office