Title:
CHIP-SHAPED SOLID ELECTROLYTIC CAPACITOR
Document Type and Number:
Japanese Patent JP2738183
Kind Code:
B2
Abstract:
PURPOSE: To provide a title capacitor excellent in volume efficiency and in reliability and economy with no packaging failure.
CONSTITUTION: On the top and the bottom of a capacitor with a cathode conductor layer 3, a heat-resistant insulating resin plate 4 (polyimide) having electrode terminals 5a, 5b different in thickness on both ends keeps the thick electrode terminal 5b connected to an anode lead 2 by a conductive adhesive 6, and the other thin electrode terminal 5a connected to the cathode conductor layer 3 electrically and mechanically. This design dispenses with use of external electrode leads, so that tomb stone phenomenon upon component packaging can be prevented because of excellent volume efficiency and high precision of electrode terminal shape; further, because of a thick electrode terminal on the side connected to an anode lead, connection reliability is high, and so is economy effect.
Inventors:
SAIKI YOSHIHIKO
Application Number:
JP27163691A
Publication Date:
April 08, 1998
Filing Date:
October 21, 1991
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01G9/004; H01G9/012; (IPC1-7): H01G9/004; H01G9/012
Domestic Patent References:
| JP55140222A | ||||
| JP4246812A | ||||
| JP59119030U | ||||
| JP588941U |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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