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Title:
CHIP STAGE Z-AXIS DRIVING MECHANISM OF BONDING MACHINE
Document Type and Number:
Japanese Patent JPH06168983
Kind Code:
A
Abstract:

PURPOSE: To facilitate the fine adjustment of a bonding machine, by making a cam follower fixed to a chip stage driving table capable of freely elevating follow a cam fixed to a Z-axis driving motor of a chip stage driver.

CONSTITUTION: The Z-axis driving of a chip stage 16 is transmitted via a cam follower 29, by a rotary cam 28 connected with a Z-axis driving motor 25 via a coupling 27. That is, when a chip stage Z-axis driving motor 25 rotates, a rotary cam 28 rotates. The cam follower 29 moves up and down according to the shape of the rotary cam 28. Thereby a sheeter table 24 connected with the cam follower 29 is moved up and down along a cross table 23, and a chip stage 16 arranged on the sheeter table 24 is moved up and down. Hence fine adjustment is facilitated by inputting the numerical value of the height of the Z-axis.


Inventors:
TERADA TORU
KOBAYASHI TATSUHARU
MATSUMOTO YASUHISA
Application Number:
JP11082292A
Publication Date:
June 14, 1994
Filing Date:
April 03, 1992
Export Citation:
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Assignee:
SHIBUYA KOGYO CO LTD
International Classes:
G12B5/00; H01L21/60; (IPC1-7): H01L21/60; G12B5/00
Domestic Patent References:
JPH0353193A1991-03-07
JPS5143675A1976-04-14
Attorney, Agent or Firm:
Katsushi Nishina