CHIP-SUPPORTING SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE

Title:

CHIP-SUPPORTING SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2002270651

Kind Code:

A

Abstract:

To realize simultaneous and quick formation of the multiple number of holes at a low cost, by chemically forming holes for external connection terminals of a chip-supporting substrate for a semiconductor package.

A 25 μm film, having an insulating layer and a photosensitive layer, is press-bonded on a copper foil of 18 μm in thickness by a laminator. The photosensitive layer is printed and developed to make holes, and the insulation layer is etched using the developed layer as an etching resist to make the holes. After the photosensitive layer has been peeled, a circuit is formed on the copper foil using the insulating layer as a support substrate as it is, and the thus the chip-supporting substrate for a semiconductor package can be obtained.

Inventors:

NAOYUKI SUSUMU
FUKUTOMI NAOKI
ICHIMURA SHIGEKI
OHATA HIROTO

Application Number:

JP2002040773A

Publication Date:

September 20, 2002

Filing Date:

May 16, 1997

Export Citation:

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Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

H01L21/60; (IPC1-7): H01L21/60

Attorney, Agent or Firm:

Hotaka Tetsuo

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