To provide a chip type aluminum electrolytic capacitor wherein stable solder fillet formation is enabled in accordance with soldering state.

In this chip type aluminum electrolytic capacitor, stepped profiles are arranged so that it may become thin in the flat thickness direction on flat portion tips 1ab, 1bc of a pair of lead lines, and distance between a flat portion upper surface where solder deposition exists and a land 8 surface on a substrate becomes short. As a result, the flat portion upper surface and solder on the land 8 of the substrate which are melted at the time of reflow soldering are stably brought into contact with each other, so that the chip type aluminum electrolytic capacitor can be provided wherein the stable solder fillet 7 can be formed in accordance with soldering state.