To provide a chip capacitor in which the anode and anode lead frame of a capacitor element can surely be connected to each other with a simple constitution and, at the same time, which can be surface-mounted in a stable state, and to provide the lead frame of the chip capacitor.

The capacitor element 1, in which an anode lead wire 3 protrudes from the central part of one end is formed and a cathode layer 4 is formed on at least part of the external surface, is mounted on a cathode lead frame 31. The cathode lead frame 31 is connected to the cathode layer 4. The anode lead wire 3 is provided with a surface-mounting section 32a and a rising section 32b connected to the side face of the surface-mounting section 32a, in a state with the section 32b being arranged in parallel with the side face. The portion of the rising section 32a other than its root is bent so that the section 32b is disposed on the surface-mounting section 32a perpendicularly to the anode lead wire 3, after the section 32b is vertically raised at the root section.