To prevent markers from deviating from the position relation with a coil, after burning.
This chip-type component manufacturing method includes first to sixth processes. In the first process, an underplate 14 is formed. In the second process, a plurality of coils are aligned to the nuderplate 14; in the third process, the underplate 14 is mounted to a molding die 8, and at the same time, a forming material is put into the forming die for forming a forming plate 17; in the fourth process, the forming plate 17 is burned; in the fifth process, the burned forming plate 17 is cut to each specific size; and in the sixth process, the markers 15a to 15c used for determining a dispensing position to the forming plate 17 in the fifth process are provided in an alignment region (b) of a plurality of component element bodies in processes, prior to the fourth process.
HESAKI MASATAKA
ITO YOICHIRO
Next Patent: CHIP-TYPE COMPONENT-MANUFACTURING METHOD