To obtain a chip-type composite functional element which has thin protective layers and can improve the moisture resistance of a film dielectric.
A chip-type composite functional element is provided with four terminal electrodes 12a-12d provided on an insulating substrate 11, a film dielectric 13 formed between the layers of two adjacent terminal electrode pairs 12a and 12b, a film resistor 15, which is formed between one paired adjacent terminal electrodes 12c and 12d on the surface of the substrate 11 opposite to the film dielectric 13. The functional element is also provided with protective layers, which respectively cover the dielectric 13 and a resistor 15. The protective layer of the dielectric 13 is constituted into a double structure of a lower crystallized glass layer and an upper amorphous glass layer.
IZEKI TAKESHI
IKEDA TAKASHI
NISHIDA KOJI
Next Patent: CHIP-SHAPED SOLID-STATE ELECTROLYTIC CAPACITOR AND MANUFACTURE THEREOF