PURPOSE: To manufacture a chip type current protecting element with good reliability and high insulating resistance after fused by having an insulating substrate, a pair of electrodes and a current protecting element wiring portion provided with a portion not adhered to the insulating substrate.
CONSTITUTION: An organic resin insulating base material 2 is manufactured by pasting an extremely thin copper foil 1 on one face and a copper foil 3 on the other face to form the pattern of the current protecting element wiring portion of wiring thickness 3-8μm. The pattern is formed for a plural of current protecting element wiring portions 5 to be longitudinally in series across the electrode portion 4 and laterally in one line of continuously parallel arrangement. The current protecting element wiring portion formed and the organic resin insulating base material 21 with the copper foil 3 on one face are layered and adhered together via adhesive with a metal plate 6. One metal plate 6 with a hole is then used to make a non-adhered portion 7. An end face adhering hole 8 is made in such a laminated plate, plating 9 is applied thereto and then an electrode portion 10 is formed with etching.
NISHIMURA KOJI
IWASAKI YORIO
TANIGUCHI MINORU
TETSUPOUZUKA MITSUO
SHIMIZU WATARU
KOBORI HISACHIKA
TAKADA KOSUKE
