To prevent troubles by static electricity from occurring when a cover tape is peeled, and in addition, to make the application possible in a clean room since troubles resulting from paper powder is extremely less.

A paper which is made by internally attaching a conductive fiber is impregnated with a resin emulsion. In this case, the conductive fiber is manufactured with a melting composite spinning thread to which a beating process has been applied. The resin emulsion is selected from an acrylic acid ester copolymer, an acrylonitrile-butadiene copolymer (NBR), a styrene-butadiene copolymer (SBR), a polyurethane resin, a polyester based resin, a polyvinyl acetate, and an ethylene-vinyl acetate copolymer (EVA). For this chip type electronic component housing pasteboard, the surface electric resistance value of the paper under an environmental condition at 23°C and 50% RH is set to be 1×109 Ω or lower.