To provide a chip-type electronic component which improves flatness without the provision of a secondary electrode, and to provide a manufacturing method therefore.

The chip-type electronic component comprises: a rectangular-shaped chip substrate provided with a surface electrode on the surface thereof and a back electrode on the back thereof; an overcoat layer provided on the surface of the chip substrate; and a side electrode, provided on the side of the substrate, for electrically connecting the surface electrode and back electrode. On the overcoat layer, projection portions are provided that project to the side of the chip substrate and cover part of the surface electrode. The ends of the projection portions on projection side are extended until the side of the chip substrate. Alternatively, the projection portions are provided on four corners of the overcoat layer. The method of manufacturing the chip-type electronic component is also provided.