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Title:
CHIP-TYPE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3460683
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a chip-type electronic component, having a glass coat layer resistant to crackings and a ceramic member whose insulation resistance is hard to degrade, and to provide a method of manufacturing the same.
SOLUTION: A laminate capacitor has a laminate 11, made of laminated ceramic green sheets; internal electrodes 12, 13 printed on the green sheet; external electrodes 14, 15 formed at both end portions of the laminate 11; and a glass coat layer for covering the surface of the laminate 11 except for the part, where the external electrodes are formed. In the glass coat layer 16, the atomic ratio of alkaline metal element content to silicon element content is gradually increased from the surface to the inside. This laminate capacitor is formed by coating the laminate 11 with the glass coat layer 16, in which the atomic ratio of alkaline metal content to silicon content is 0.3 or more, and then by dipping the coated laminate 11 in an acidic aqueous solution.


Inventors:
Atsushi Kishimoto
Masahiro Kodama
Hideaki Niimi
Application Number:
JP2000220694A
Publication Date:
October 27, 2003
Filing Date:
July 21, 2000
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/12; H01G2/12; H01G4/06; H01G4/224; H01G4/30; H01G7/00; H01L37/00; (IPC1-7): H01G4/30; H01G4/12; H01G4/224
Domestic Patent References:
JP2000106304A
JP11340090A
Attorney, Agent or Firm:
Takekazu Morishita