Title:
チップ型電子部品収納台紙および製造方法
Document Type and Number:
Japanese Patent JP5610414
Kind Code:
B2
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Inventors:
末永 浩
網野 東吾
網野 東吾
Application Number:
JP2008329827A
Publication Date:
October 22, 2014
Filing Date:
December 25, 2008
Export Citation:
Assignee:
王子ホールディングス株式会社
International Classes:
B65D85/86; B65D65/40; B65D73/02; D21H17/63; D21H21/14; D21H27/10
Attorney, Agent or Firm:
Kanaya 宥