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Title:
CHIP TYPE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH08288177
Kind Code:
A
Abstract:

PURPOSE: To accurately make connection of an internal electrode with an external electrode by a method wherein adhesives for adhering substrates to each other are not applied to an end part of a lead-out electrode part of the substrate, whereby a groove that the lead-out electrode component is exposed is formed on a side face of a stacked body and a part of the external electrode is inserted into this groove.

CONSTITUTION: Internal electrodes 20 of which a part is faced to each other via a piezoelectric substrate 10 are respectively provided on both surfaces of the substrate 10. The electrode 20 is composed of an oscillation electrode part 21 and a lead-out electrode part 22, and on both surfaces of the substrate 10 formed with the electrode 20, insulating adhesives 30 are applied to a portion except for an end part of the electrode part 22 and the electrode part 21, so that a protection substrate 40 is adhered to both surfaces of the substrate 10. A space 51 is formed between the electrode part 21 to which the adhesives 30 are not applied and the substrate 40, and a groove 52 is formed on a side surface of a laminate 6. When a face forming external electrode 60 is mounted to the side surface and the end part of the laminate 6, a part of this electrode 60 is inserted into the groove 52 and electrically connected to the electrode 20 exposing to the inside of the groove 52.


Inventors:
Hasegawa, Takashi
Itoku, Kimiko
Application Number:
JP1995000113924
Publication Date:
November 01, 1996
Filing Date:
April 14, 1995
Export Citation:
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Assignee:
TOKO INC
International Classes:
H01G4/228; H01G4/252; H01G4/30; (IPC1-7): H01G4/252; H01G4/228; H01G4/30
Attorney, Agent or Firm:
大田 優



 
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