PURPOSE: To make the impedance larger without increasing the length of a magnetic path, by performing molding so as to cover ferrite sintered bodies having a plurality of grooves and a plurality of leads put in the grooves with resin containing ferrite.

CONSTITUTION: Copper-family leads 1 having large moduli of elasticity are formed into the shape of U. Ferrite sintered bodies 2 belong to an Ni-Zn family, and each three surfaces other than the bottoms have grooves 4. Leads 1 are fitted to the ferrite sintered bodies 2 by insertion like clips. Then the leads 1 are molded so as to cover the peripheries of the ferrite sintered bodies 2 with resin 3 containing ferrite excluding parts of the leads 1 not touching the ferrite sintered bodies. Incidentally, the resin containing ferrite is composed of thermosetting resin and 85-90-wt.% of the powder of a ferrite sintered body 2 having particle diameters 11-54μm.