PURPOSE: To improve the spurious characteristic of the chip piezoelectric resonator by providing surely a damping member only to a required area so as to prevent the damping member from being adhered or blurred in an undesired direction of the damping member thereby preventing deterioration in close adhesion of an outer package resin.

CONSTITUTION: The resonator includes a piezoelectric resonator 37 including plural vibration electrodes 4, 5, 13 opposite to each other with a piezoelectric substrate 33 inbetween and a terminal electrode connecting respectively to the vibration electrodes while utilizing the thickness-share vibration. When a damping member is provided to cover the vibration region of the piezoelectric resonator element 37, the damping member 66 cured in advance on a thin sheet 65 is adhered to the piezoelectric resonance element together with the sheet 65. Then an outer package is provided to cover the piezoelectric resonance element 37 and an external electrode connected electrically to a terminal electrode is formed.