To enhance reliability in mechanical strength or temperature cycle performance, etc., by a method wherein, in an external electrode, a conductive metal layer is brought into contact with an end face of a chip-like thermistor element, a conductive resin layer is formed on the conductive metal layer, and a metal plating layer is formed on the conductive resin layer.

A chip type thermistor 10A is formed with an external electrode 2 at both end faces of a rectangular parallelepiped chip-like thermistor element 1 composed of a ceramic sintered body, and an insulation inorganic substance layer of a glass layer 3, etc., is provided so as to cover two opposite side faces having a larger area among four side faces other than these both end faces. In an external electrode 2, a conductive metal layer 2a is brought into contact with an end face of the chip-like thermistor element 1, and a conductive resin layer 2b is formed thereon. A metal plating layer 2c is formed on the conductive resin layer 2b, and is a two-layer structure of a Ni plating layer 2d and a solder plating layer 2e. Thereby, it is possible to enhance mechanical strength and cycle performance, etc.