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Title:
CHUCK TABLE, CUTTING DEVICE, AND METHOD FOR CORRECTING CHUCK TABLE OF CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2019150929
Kind Code:
A
Abstract:
To provide a chuck table, a cutting device, and a method for correcting a chuck table of a cutting device, which can suppress occurrence of crack of a rear side and corner crack of a work-piece during cutting.SOLUTION: A chuck table 20 comprises a main body part 21 that holds a work-piece 100 by a holding surface 21a via a dicing tape 106 and a clamp 22 for holding a frame 107 by an outer periphery of the main body part 21. The main body part 21 has: the holding surface 21a constituted of a flat surface; a suction groove 21b, formed in an area in the holding surface 21a at which annular areas 106A between the work-piece 100 of a frame unit 108 and frames 107 overlap with each other, which suctions and holds the dicing tape 106 in the annular areas 106A; and a suction path 21c through which the suction groove 21b is communicated with a suction source 32. The clamp 22 pulls down the frames 107 from the holding surface 21a and then holds the frames, and closely contacts the dicing tape 106 with the holding surface 21a.SELECTED DRAWING: Figure 3

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Inventors:
YAMAMOTO SETSUO
SEKIYA KAZUMA
Application Number:
JP2018038871A
Publication Date:
September 12, 2019
Filing Date:
March 05, 2018
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B27/06; B24B41/06; B24B47/22; B28D1/24; B28D7/00; B28D7/04; H01L21/301; H01L21/683
Domestic Patent References:
JPH11307619A1999-11-05
JP2009043771A2009-02-26
JP2011009424A2011-01-13
JP2004356357A2004-12-16
JP2005335999A2005-12-08
JPWO2011077911A12013-05-02
Attorney, Agent or Firm:
Sakai International Patent Office