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Patent Searching and Data


Title:
CIRCUIT ARRANGEMENT
Document Type and Number:
Japanese Patent JP2009108719
Kind Code:
A
Abstract:

To provide a circuit arrangement capable of reducing influence of heat generation on a printed board when large current flows in BATT wiring and GP wiring provided in the printed board respectively.

Each switching device 30 is placed between a battery terminal 43 and GP terminals 44 so that the one side surface of each switching device 30 may face a straight line 80 extending in vertical to one direction in which the battery terminal 43 and the GP terminals 44 are placed. Under this constitution, the BATT wiring 60 is placed on the battery terminal 43 side, and the GP wiring 70 is placed on the GP terminals 44 side, thus forming an arrangement relation not interposing a part of the printed board 40 between the BATT wiring 60 and the GP wiring 70.


Inventors:
HAYASHI MASATO
Application Number:
JP2007280113A
Publication Date:
May 21, 2009
Filing Date:
October 29, 2007
Export Citation:
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Assignee:
DENSO CORP
International Classes:
F02P19/02; H01L25/07; H01L25/18
Domestic Patent References:
JP2005079552A2005-03-24
JP2007012721A2007-01-18
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno