Title:
回路基板アセンブリおよびその半製品、投光器、撮像モジュールおよびそれらの使用
Document Type and Number:
Japanese Patent JP7185020
Kind Code:
B2
Abstract:
The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.
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Inventors:
黄 ▲貞▼
Junjie Tseng
▲許▼ 晨祥
▲陳▼ ▲飛▼帆
Junjie Tseng
▲許▼ 晨祥
▲陳▼ ▲飛▼帆
Application Number:
JP2021509985A
Publication Date:
December 06, 2022
Filing Date:
July 25, 2019
Export Citation:
Assignee:
Ning Hashun Umitsu Den
International Classes:
H05K1/02; H01L27/146
Domestic Patent References:
| JP2013206895A | ||||
| JP2011222870A | ||||
| JP2011517125A | ||||
| JP3172667U | ||||
| JP2015508509A | ||||
| JP2016535533A | ||||
| JP201560998A | ||||
| JP2017175004A |
Foreign References:
| US20090153729 | ||||
| US20110061340 | ||||
| US20130334445 | ||||
| EP3258493A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Shinei Office