Title:
回路基板、回路基板モジュールおよび、アンテナモジュール
Document Type and Number:
Japanese Patent JP6741186
Kind Code:
B2
Abstract:
The present disclosure relates to an interposer (120), which is a circuit board that has a multilayer structure and that establishes a connection between layers using a via conductor. The interposer (120) includes first and second transmission lines that are connected in series and a first stub and a second stub that are respectively connected to the first transmission line and the second transmission line. The first and second stubs are formed by wiring lines provided in respective different layers, and a second transmission line (123), which connects the first stub to the second stub, includes a via conductor and a wiring line provided in the layer where the second stub (124) is formed.
Inventors:
Naoshi Sugawara
Takai Ishii
Kengo Onaka
Takai Ishii
Kengo Onaka
Application Number:
JP2020514296A
Publication Date:
August 19, 2020
Filing Date:
August 02, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01P3/08; H01L23/12; H01L25/00; H01P1/203; H01P5/02; H01P7/08; H01Q23/00; H05K1/02; H05K3/46
Domestic Patent References:
| JP20119505A | ||||
| JP201846213A | ||||
| JP4287503A |
Foreign References:
| US20150180107 |
Attorney, Agent or Firm:
Fukami patent office