Title:
整列したナノ構造物を含む回路基板
Document Type and Number:
Japanese Patent JP4729095
Kind Code:
B2
Inventors:
Hong Seung Hoon
Li Min-bek
Li Min-bek
Application Number:
JP2008310521A
Publication Date:
July 20, 2011
Filing Date:
December 05, 2008
Export Citation:
Assignee:
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
International Classes:
H05K1/09; B82B1/00; B82B3/00; H05K3/10
Domestic Patent References:
| JP2007158117A | ||||
| JP2007329351A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Toshifumi Onuki