Title:
電気的に機能する回路基板コア材
Document Type and Number:
Japanese Patent JP7209026
Kind Code:
B2
Abstract:
An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
Inventors:
Brandon Sammy
Peter A. Bryce
Robert Andrew Ramsbottom
Jeffrey Portrac
courtney elliott
Peter A. Bryce
Robert Andrew Ramsbottom
Jeffrey Portrac
courtney elliott
Application Number:
JP2021015238A
Publication Date:
January 19, 2023
Filing Date:
February 02, 2021
Export Citation:
Assignee:
Kemet Electronics Corporation
International Classes:
H05K3/46; H01G2/06; H01G9/15; H05K1/16
Domestic Patent References:
| JP2009194381A | ||||
| JP2019504487A | ||||
| JP2008227484A | ||||
| JP2011216636A | ||||
| JP2011249792A |
Foreign References:
| US20080030929 | ||||
| WO2001019149A1 | ||||
| US20070190686 | ||||
| EP3340752A1 |
Attorney, Agent or Firm:
Saegusa International Patent Office