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Patent Searching and Data


Title:
CIRCUIT BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2016076622
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit board which enables a heat conduction member to be assembled to a through hole of the circuit board without increasing the manufacturing costs, and to provide an electronic device.SOLUTION: In a circuit board 20, a male screw part 32 is formed on an outer peripheral surface of a heat conduction member 30 for radiating heat of a heating component 40. The heat conduction member 30 is screwed into a through hole 22 to be assembled to the circuit board 20.SELECTED DRAWING: Figure 1

Inventors:
MURASE TASUKU
YASHIRO KENICHI
Application Number:
JP2014206626A
Publication Date:
May 12, 2016
Filing Date:
October 07, 2014
Export Citation:
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Assignee:
DENSO CORP
International Classes:
H01L23/36; H01L23/12; H01L23/40; H05K1/02; H05K7/20
Domestic Patent References:
JP2008028254A2008-02-07
JP2013123011A2013-06-20
JPH03268348A1991-11-29
JPS5844854U1983-03-25
JP2000091481A2000-03-31
Attorney, Agent or Firm:
田下 明人
立石 克彦