Title:
CIRCUIT BOARD AND MANUFACTURE OF CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3482712
Kind Code:
B2
Abstract:
PURPOSE: To provide a method of manufacturing a high density circuit board.
CONSTITUTION: Through holes 2 are bored in an insulating board 1 of a resin film. It is sandwiched between adhesive material sheets 4 in which conductive particles 3 are dispersed and copper foils 5 (c). In this state, a pressure is applied in the vertical direction, via silicone rubber 6 and metal plates 7, and the adhesive material sheets 4 are cured by heating. As the result of pressing, the copper foils 5 comes into contact with each other in the through holes 2, via the conductive particles 3. Hence electric connection appears. A copper foil patterning process is performed on the unified board (e), and circuits 9a, 9b are formed. Thereby a double-sided board shown by figure (f) is obtained.
Inventors:
Toshihiro Nishii
Shinji Nakamura
Toshiaki Takenaka
Sadao Mitamura
Kunio Kishimoto
Shinji Nakamura
Toshiaki Takenaka
Sadao Mitamura
Kunio Kishimoto
Application Number:
JP26956694A
Publication Date:
January 06, 2004
Filing Date:
November 02, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/46; H05K1/03; H05K1/11; H05K3/40; H05K3/32; H05K3/38; (IPC1-7): H05K3/40; H05K1/03
Domestic Patent References:
| JP5759398A | ||||
| JP330494A | ||||
| JP335583A | ||||
| JP59117291A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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