Title:
CIRCUIT BOARD MANUFACTURING METHOD AND ITS MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP2004039887
Kind Code:
A
Abstract:
To solve the problem that, when a cover film is exfoliated, conductive paste with which a via-hole is filled up to the surface of the cover film is partially removed to increase a resistance value in interlayer connection.
There are provided a process in which the via-hole is filled by using a squeezee 7 with the conductive paste 6 put on the surface of an insulating board 1, and a process in which the cover film 4 is exfoliated pressing the surface of the cover film 4 in the direction of the insulating board 1.
Inventors:
NAKAYA YASUHIRO
KOYAMA MASAYOSHI
ECHIGO FUMIO
KOYAMA MASAYOSHI
ECHIGO FUMIO
Application Number:
JP2002195485A
Publication Date:
February 05, 2004
Filing Date:
July 04, 2002
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/40; (IPC1-7): H05K3/40
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito