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Title:
CIRCUIT BOARD PROVIDED WITH MINUTE PROBES AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2998988
Kind Code:
B2
Abstract:
Disclosed is a microprobe-provided circuit substrate for use as a probe assembly or the like, and a method for producing the same. The microprobes in the circuit substrate are constituted by pillar-shaped conductors provided in respective fine through holes formed in a base and having one ends projected out of the respective fine through holes. The circuit substrate having microprobes of such a structure as described above can be produced by the method for producing a microprobe-provided circuit substrate in which pillar-shaped conductors as precursors of microprobes are provided by an electroless plating method or the like in fine through holes formed in a base by a photographic method or the like, and then the microprobes are formed by projecting one ends of the respective pillar-shaped conductors out of a surface of the base by etching treatment or the like. Thus, it is possible to eliminate difficulties in fining microprobes, in positioning the respective microprobes accurately, in diversifying the arrangement of the microprobes, and the like, which are caused by the conventional process of producing a circuit substrate by manually fixing electrically conductive metals as precursors of microprobes at predetermined positions on a base.

Inventors:
SUGIHARA OSAMU
Application Number:
JP33645690A
Publication Date:
January 17, 2000
Filing Date:
November 30, 1990
Export Citation:
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Assignee:
HOYA CORP
International Classes:
G01R1/06; G01R31/26; G01R1/073; H01L21/66; H05K13/08; (IPC1-7): H01L21/66; G01R1/073; G01R31/26
Domestic Patent References:
JP4991582A
JP60189949A
JP647632A
JP61127633A
JP62207730A
JP644042A
JP2141681A
JP1296535A
JP60224555A
JP60234853A
JP6135259A
JP63208237A
JP3293566A
JP451535A
JP2210846A
JP5459267U
JP61179747U
JP501314Y1
Attorney, Agent or Firm:
Shizuo Nakamura



 
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