To provide a circuit board resin composition which has a low dielectric constant and dissipation factor and excels in heat resistance and adhesion, a prepreg and a laminate which use the same.

The circuit board resin composition comprises a compound containing two or more maleimide groups in the molecule such as 2,2'-[4-(4-maleimidophenoxy)phenyl]propane and bis-(3-ethyl-5-methyl-4-maleimidophenyl)methane and a compound containing one or more styryl groups in the molecule such as 1-phenyl-3-(4-t-butylstyryl)-5-(4-t-butylphenyl)pyrazoline, and the prepreg and the laminate use the same.