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Patent Searching and Data


Title:
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3962347
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To prevent a rapture of a resistor film by eliminating the local thermal expansion of a dielectric film caused by heat from a resistor in a circuit board having the resistor film on the dielectric film.
SOLUTION: In the circuit board, a resistor film 6 and a wiring conductor film 7 are provided in direct contact on a BCB film 3 which is the dielectric film of a microstrip line. Then a recess 10 wherein the thickness of the BCB film 3 immediately under the resistor film 6 is made smaller in comparison with others is formed, and the resistor film 6 is formed on the BCB film 3 in the recess 10. Through the thinned portion, the heat of the resistor film 6 is quickly dissipated to a ground conductor film 2.


Inventors:
Hiroyuki Sakai
Yoshito Ikeda
Ota Junmichi
Kaoru Inoue
Nishii Katsunori
Takayuki Yoshida
Application Number:
JP2003090514A
Publication Date:
August 22, 2007
Filing Date:
March 28, 2003
Export Citation:
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Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/12; H05K1/16; H05K1/02; H05K1/18; (IPC1-7): H01L23/12; H05K1/02; H05K1/16; H05K1/18
Domestic Patent References:
JP9219422A
JP8153853A
JP9260583A
JP997818A
JP1064953A
JP3114252A
JP3239357A
JP4273196A
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Takashi Goto
Iseki Katsumori