Title:
CIRCUIT BOARD TYPE TEMPERATURE FUSE
Document Type and Number:
Japanese Patent JP3889855
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To increase the electric current capacity, and quicken an actuating speed by connecting plural low melting point fusible allay pieces in parallel between a pair of membrane electrodes arranged on a thermally good conductive insulating substrate, applying flux to this, and also constituting so as to cover an insulator.
SOLUTION: An insulator 16 is covered after flux 15 is applied on plural low melting point fusible allay pieces 14 connected between a pair of membrane electrodes 12 which are arranged on an insulating substrate 11 such as an alumina ceramic plate and to which lead wires 13 are connected. The low melting point fusible allay pieces 14 are connected in plurality in parallel to each other, and an electric current capacity increases, and its cross-sectional area is desirably set not more than 0.8 mm2, and actuating time become 20 seconds or less, and a fusing speed quickens. For example, one of the membrane electrodes 12 is formed in a circular arc shape, and the other is formed as the land in them, and it is desirable to set a connecting place with the radial low melting point fusible allay pieces 14 at a different interval, and disruption is quickened on the interval narrow side by cohesive force of molten alloy pulled in by wetting of the melted low melting point fusible alloy pieces 14 with the membrane electrodes 12.
Inventors:
Uemura, Mitsuaki
Application Number:
JP1997000173103
Publication Date:
December 08, 2006
Filing Date:
June 14, 1997
Export Citation:
Assignee:
UCHIHASHI ESTEC CO LTD
International Classes:
H01H37/76; H01H37/00; (IPC1-7): H01H37/76
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