PURPOSE: To provide a highly reliable circuit board at a production cost by simultaneously forming an IC carrier in a package to regulate the height of IC with a molding resin for the board.

CONSTITUTION: A lead frame 2 is integrally formed by insert molding in such a manner as to function as a support frame and a device cover in the past. In a circuit board 1 of such an arrangement, units are formed to house the following elements: a connector housing section 3 for a connector serving as an electrical connection with a display cell, a quartz oscillator housing section 4 and a battery housing section 5. For the insert molding of the lead frame 2, a thermoplastic resin is used. An IC6 is bonded on the circuit board 1 by heat bonding and then, sealed by potting of a liquid epoxy resin.