To provide a method for manufacturing a circuit board which can form a wiring pattern of high density and high accuracy, which embeds a wiring conductor and which has a smooth surface in a high productivity.
The method for manufacturing the circuit board comprises the steps of forming a nickel on one surface of a copper foil having a thickness of 35 μm by electric plating, forming a plating resist, forming the copper in a thickness of 20 μm by a method for energizing the copper foil, and forming the wiring pattern. The method further comprises the steps of releasing the resist, oxidizing the wiring copper, hot pressing the wiring copper, to integrate the copper with a glass cloth epoxy resin laminate via a glass cloth epoxy resin prepreg, embedding the wiring pattern in an insulating base, removing the copper layer on the surface by rapid etching with an etchant for selectively dissolving the copper layer up to the nickel layer formed at the initial time, and then apply quick etching of the nickel with an etchant having a reverse selectivity for manufacturing the circuit board.
TSUBOMATSU YOSHIAKI
NAKAYAMA HAJIME
KAITO KOICHI
YOSHITOMI YASUNOBU
